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PCB Software

Printed Circuit Board (PCB) Thermal Design Program Tool

Our PCB software tools used for thermal analysis in Singapore includes a comprehensive library of models for materials such as alloys, high-performance polymers, and IC packages just to list a few.
The library used in PCB simulation also includes models for common geometric shapes used in the PCB industry applications such as thermal heat sinks and fans.
PCB Software

Overcome Your PCB Software Thermal Design Challenges

Our PCB Thermal analysis services are driven by the use of the latest cutting edge and the design tools to support advanced capabilities that extend beyond conventional circuit layout and schematic design from initial concept to final production fabrication.
BroadTech Engineering enables you to leverage on cutting-edge PCB thermal design software tool features that can help you efficiently resolve every PCB technical design challenge you may encounter along the way.

Accelerate Time to Market

Speed to market is crucial so you need to be able to speed up the PCB design development workflow, which starts with access to components that you can locate and out in the place in within seconds.
The design has to be faster and more compact, with faster edge rates and ICS and DDR memory technology mainstream, signal integrity analysis is a necessity.
Advanced placement and routing features, such as PCB Thermal Relief are necessary to ensure sure that all electrical rules and spacing constraints are properly managed and met with.
PCB Designs have more mixed technologies than ever and need accurate and easy to use analog mixed-signal simulation software tools that read commercial standard spice models guaranteeing functional performance mandates for proper PCB simulation analysis

Uncover and Identify Design Issues Early

The 3D PCB thermal Simulation view rendering offers an insightful perspective of the PCB circuit layout as a finished product and true real-time cooperation with mcat displays at a virtual prototype of the final product that helps lower design development expenses by uncovering technical problems that might not be discovered until actual final fabrication during mass manufacturing.
Our thermal simulation consultants conduct DFMA simulation to includes many of the most often used manufacturing and assembly simulations, making it easier to highlight design issues that cause production delays and ensures that all design criteria are met before pushing your PCB board out for mass production/manufacturing.

Enhance Heat Power Distribution to Ensure Mechanical Structure Integrity

Avoiding design functional failures and minimizing costly mechanical structure defect issues related to thermal heat and power distribution requires electronic circuit component to be kept thermally cool.
With our PCB Thermal relief analysis, we are able to assist you to optimize PCB circuit designs for efficient thermal heat distribution to guarantee that your electronic product will function durability as design.
We are also able to make ensure that all electrical power reliability issues including DC fall are promptly solved and that engineering development expenses are optimized as you analyze and solve issues that can reduce layers and B coupling capacitors.

Featured PCB Thermal Simulation Case Studies

Our client wants a plastic box enclosure rather than the default aluminum alloy.
Methodology Approach
We modeled the housing enclosure with the material nylon polymer, followed by the addition of a thermal heat sink from the simulation tool library. As the PCB board used was fully routed, the copper metal traces can be visibly read from the file.
*Note that if the routing has not been performed or if you simply want to ignore them, we are able to change the percentage of copper and signal and power planes for PCB simulation.
Usually for a typical PCB board schematic layout, there can be many thousands of electrical components, however, for the purpose of implementing PCB thermal analysis, not all of these are essential.
The most common requirement techniques are to not include the very small components and/or those with little or no power consumption.
Our thermal analysis engineers then ran the thermal simulation solver and generated the plane plot.
There are a number of ways of interacting with the plane plot. For example, show manipulator enables you to dynamically drag the plane through the simulation model.
We conducted the thermal simulation again by changing the enclosure used to a more realistic case from our library. At the same time, we’re going to add more detailed models to the ICS when you run the PCB thermal simulation software and generate the plane plot. It was observed/noticed that the thermal temperature measured has gone down dramatically around the ICs by approximately/roughly 75 degrees C
We also study Airflow behavior by hiding the temperature scaler and choosing/selecting show vectors.
There could be a number of possible factors for this, one, for example, there are no ventilation vents in the enclosure to enable fresh air to gain entry, however, some of our modeling assumptions may also be a fault.
For example, the PCB board is simply floating so there is no conduction path to the casing additionally we have taken into account conduction and convection but not radiation.
This can be significant in cases without forced cooling where there are high-temperature differences.

Overview

About Us

BroadTech Engineering is a Leading Engineering Simulation and Numerical Modelling Consultancy in Singapore.
We Help Our Clients Gain Valuable Insights to Optimize and Improve Product Performance, Reliability, and Efficiency.

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1. Powerful Simulation Software Tools

1. Powerful Simulation Software Tools

2. Simulation Consultants with Extensive Research & Professional Experience

2. Simulation Consultants with Extensive Research & Professional Experience

3. Simulation projects Completed in a Timely and Cost-effective Manner

3. Simulation projects Completed in a Timely and Cost-effective Manner

4. Proven Track Record

4. Proven Track Record

5. Affordable

5. Affordable

6. Full Knowledge Transfer

6. Full Knowledge Transfer

Call Us for a Free Consultation

Simply call to contact us today at +6581822236 for a no obligation discussion of your needs. Our knowledgeable and friendly consultants will be happy to answer any of your questions and understand more about your needs and requirements
Alternatively, for quote request, simply email us your technical specifications & requirements to info@broadtechengineering.com