Introducing FEA Consulting

FEA Analysis

FEA Analysis Services from BroadTech Engineering provides Next Generation Solutions that Solve Today’s Toughest Engineering Challenges.

FEM Thermal

Thermal FEM Simulation Services is at the heart of what we do at BroadTech Engineering Singapore. Through our FEA services, we can use world-class FEA software to assist you in solving complex structural engineering problems to enable you to make a calculated and accurate engineering design decision within a shorter span of time.

Cutdown R&D development Time and warranty costs

Using Simcenter Femap NX Nastran for FEA Engineering Modeling by Stress Analysis Services Companies performing Structural Simulation Services, it is credited/Attributed with Drastically Lowering Expensive Company research and development (R&D) costs.

This is because in the Practice of FEA Stress Engineering, instructing a CAE Computational model, performing the FEA Failure Analysis Services and Virtually Validating Engineering performance is significantly Affordable, faster and more effective than the Actual physical prototyping processes it replaces.

With increased Engineering Design quality, Both Structural Engineering Consultancy as well as R&D Organizations can also use the Benefits of FEA Tools and Software to save on any potential warranty costs.

FEA Analysis Software Module benefits

• Quickly solve complex large Challenges such as Piping Engineering Analysis

• Use the DMP solution in 3D FEM Software to solve large problems more than 100 times faster than the Lanczos method on One single processor Core

Semiconductor/micro-electronic packaging: Thermomechanical fatigue and creep of solder joint ball grid array

1. FEA Simulation Objective:

Develop a working predictive model simulating an industry test standard (thermo-mechanical fatigue and creep) of solder joint ball grid array which can be used for multiple design evaluations which include (but not limited to) package design configuration, electrical design changes, ball grid array design and layout configurations, solder joint material changes, etc.

2. FEA Simulation Methodology and Approach:

A global 3D model set – up of the microelectronic package was used with a sub-modeling done on the affected solder joint/s; also taking advantage of symmetry. FEA was based on Darveaux’s model for solder joint fatigue modeling. Extensive work was carried out to determine the correct material properties, combining actual measurements when available, supplier measurements and extensive literature review. The accumulated creep strain energy density was found to be a comparable output when compared to the location of solder with worse performance as well as the location of fracture initiation and crack propagation path of the solder joint – when compared with the crack path of the sectioned solder joint in question after the package was subjected to the thermo-mechanical test mentioned. Furthermore, the model was validated through several methods: the modeled global warpage profile was demonstrated to follow the same profile as the actual electronic package; failure analysis of a failed solder joints in a component matched the modeled location of failures; the measured in-plane strain of the solder joint was compared and was within error tolerances of the predictive model.

3. Outcome & Conclusion:

A predictive model was obtained and best – known – methods of the modeling approach were captured and shared with global teams.

Overview

1. FEA Consulting

FEA Simulation
FEA Analysis & FEA Modeling
FEA Consulting Services
FEA Software

2. CFD Consulting

3. EM SC Consulting

1. PCB Simulation
2. SI, PI, S-Parameters
3. Return/Insertion Loss
4. Cross Talk, Eye Diagram
5. RLC Extraction

About Us

BroadTech Engineering is a Leading Engineering Simulation and Numerical Modelling Consultancy in Singapore.
We Help Our Clients Gain Valuable Insights to Optimize and Improve Product Performance, Reliability, and Efficiency.

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Featured Thermal FEM Simulation Case Studies

FEA Designs Validation of a pipe tee connecting pipework at the high-pressure manifold

1. FEA Simulation objective:

The project aimed to assess three different designs of a pipe tee connecting pipework from a high-pressure manifold to a low-pressure manifold on behalf of a customer (Zotefoams, London UK).

2. FEA Simulation Methodology and Approach:

The pipework was assessed according to the ASME III standards. The relevant pipework was modeled using 3D finite element (FE) analysis and exposed to the operating pressure and temperature. Linearised stresses along the highly stressed ligament within the pipework were extracted and used in a fatigue assessment by ASME VIII standards. The project was conducted using ABAQUS 6.14 finite element software.

According to ASME VIII fatigue assessment, stresses along the highly stressed ligament in a structure should not exceed a stress limit evaluated based on the material and the intended lifecycle. Also before conducting a fatigue analysis, it should be shown that the component will shakedown after a few cycles. In this assessment, shakedown was demonstrated using FE analysis by subjecting the pipework to a few cycles to demonstrate no plastic strain accumulation within the pipework components. Note that FE had to be used to demonstrate shakedown because the linearised stresses across the highly stressed ligament did not satisfy shakedown conditions due to the complexity of the secondary stresses present.

3. Outcome & Conclusion

The results from the FE analysis showed that one of the designs was compliant with the ASME III standards.

Motorcycle Design Improvement