Introducing FEA Consulting


FEA Analysis

FEA Analysis Services from BroadTech Engineering provides Next Generation Solutions that Solve Today’s Toughest Engineering Challenges.


FEM Thermal

Thermal FEM Simulation Services is at the heart of what we do at BroadTech Engineering Singapore. Through our FEA services, we can use world-class FEA software to assist you in solving complex structural engineering problems to enable you to make a calculated and accurate engineering design decision within a shorter span of time.

Cutdown R&D development Time and warranty costs 

Using Simcenter Femap NX Nastran for FEA Engineering Modeling by Stress Analysis Services Companies performing Structural Simulation Services, it is credited/Attributed with Drastically Lowering Expensive Company research and development (R&D) costs.
This is because in the Practice of FEA Stress Engineering, instructing a CAE Computational model, performing the FEA Failure Analysis Services and Virtually Validating Engineering performance is significantly Affordable, faster and more effective than the Actual physical prototyping processes it replaces.
With increased Engineering Design quality, Both Structural Engineering Consultancy as well as R&D Organizations can also use the Benefits of FEA Tools and Software to save on any potential warranty costs.

FEA Analysis Software Module benefits

• Quickly solve complex large Challenges such as Piping Engineering Analysis
• Use the DMP solution in 3D FEM Software to solve large problems more than 100 times faster than the Lanczos method on One single processor Core

Semiconductor/micro-electronic packaging: Thermomechanical fatigue and creep of solder joint ball grid array


1. FEA Simulation Objective:
Develop a working predictive model simulating an industry test standard (thermo-mechanical fatigue and creep) of solder joint ball grid array which can be used for multiple design evaluations which include (but not limited to) package design configuration, electrical design changes, ball grid array design and layout configurations, solder joint material changes, etc.
2. FEA Simulation Methodology and Approach:
A global 3D model set – up of the microelectronic package was used with a sub-modeling done on the affected solder joint/s; also taking advantage of symmetry. FEA was based on Darveaux’s model for solder joint fatigue modeling. Extensive work was carried out to determine the correct material properties, combining actual measurements when available, supplier measurements and extensive literature review. The accumulated creep strain energy density was found to be a comparable output when compared to the location of solder with worse performance as well as the location of fracture initiation and crack propagation path of the solder joint – when compared with the crack path of the sectioned solder joint in question after the package was subjected to the thermo-mechanical test mentioned. Furthermore, the model was validated through several methods: the modeled global warpage profile was demonstrated to follow the same profile as the actual electronic package; failure analysis of a failed solder joints in a component matched the modeled location of failures; the measured in-plane strain of the solder joint was compared and was within error tolerances of the predictive model.
3. Outcome & Conclusion:
A predictive model was obtained and best – known – methods of the modeling approach were captured and shared with global teams.




LS-DYNA Consulting

3. EM SC Consulting

1. PCB Simulation
2. SI, PI, S-Parameters
3. Return/Insertion Loss
4. Cross Talk, Eye Diagram
5. RLC Extraction

About Us

BroadTech Engineering is a Leading Engineering Simulation and Numerical Modelling Consultancy in Singapore.
We Help Our Clients Gain Valuable Insights to Optimize and Improve Product Performance, Reliability, and Efficiency.


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3. LS-DYNA Consulting
3. LS-DYNA Consulting
3. LS-DYNA Consulting
3. LS-DYNA Consulting
3. LS-DYNA Consulting
3. LS-DYNA Consulting

Featured Thermal FEM Simulation Case Studies


FEA Designs Validation of a pipe tee connecting pipework at the high-pressure manifold


1. FEA Simulation objective:
The project aimed to assess three different designs of a pipe tee connecting pipework from a high-pressure manifold to a low-pressure manifold on behalf of a customer (Zotefoams, London UK).
2. FEA Simulation Methodology and Approach:
The pipework was assessed according to the ASME III standards. The relevant pipework was modeled using 3D finite element (FE) analysis and exposed to the operating pressure and temperature. Linearised stresses along the highly stressed ligament within the pipework were extracted and used in a fatigue assessment by ASME VIII standards. The project was conducted using ABAQUS 6.14 finite element software.
According to ASME VIII fatigue assessment, stresses along the highly stressed ligament in a structure should not exceed a stress limit evaluated based on the material and the intended lifecycle. Also before conducting a fatigue analysis, it should be shown that the component will shakedown after a few cycles. In this assessment, shakedown was demonstrated using FE analysis by subjecting the pipework to a few cycles to demonstrate no plastic strain accumulation within the pipework components. Note that FE had to be used to demonstrate shakedown because the linearised stresses across the highly stressed ligament did not satisfy shakedown conditions due to the complexity of the secondary stresses present.
3. Outcome & Conclusion
The results from the FE analysis showed that one of the designs was compliant with the ASME III standards.

Motorcycle Design Improvement


1. FEA Simulation Objective:
The motorcycle prototype will be subjected to some durability test procedure. When there is crack/fracture occurred during the test, the simulation will be done to help to understand the cause of the problem and to improve the structure design. 
2. FEA Simulation Methodology and Approach:
The simulation result will be compared to data (strain gage, accelerometer, etc) obtained from measurement at the actual environment. From this comparison, we can find the specific resonance which is causing the crack/fracture. After finding the specific resonance, design improvement will be done based on the simulation. The design iteration will be continuously done until the strain/acceleration level is reduced until an acceptable level.
The type of simulation used was the “Frequency Response” simulation.
3. Outcome & Conclusion
After the objective was reached, the new prototype will be fabricated. After fabrication, another data measurement will be done at the actual environment to check if the strain/acceleration is acceptable according to simulation.

Fatigue and Thermal Analysis of Hydrogen Tank Liner under Inner Pressure


1. FEA Simulation objective:
To check the deformation of liner in the experiment and investigate the reason; To check whether the deformation under inner pressure 1,750 bar occurs at high temperature 85°C or low temperature -40°C; To assess the fatigue cycles of the liner at different temperatures.
2. FEA Simulation Methodology and Approach:
Non-linear FEM code of Abaqus Standard is adopted to solve this problem. 2D Axisymmetric model (element type CAX4R) is used. Temperature-dependent material properties and boundary conditions are applied. Loadings are as the following:  assemble to resolve the overclosure in step 1, change the temperature from 23°C to 85C°C (or -40°C) in step 2, apply inner pressure 1,750 bar in step 3.  Stress, strain and displacement results are shown in post-processing and compared with material fatigue data.
3. Outcome & Conclusion:
The deformed area on the liner is most likely due to the contact between the seal and liner and can be predicted via the analysis. This contact is more severe at 85°C and appears to be related to the thermal expansion differences between the various materials. Modifying the thickness of the liner may not improve the situation as previously expected. Another issue is that the thickness of the aluminum boss is reduced and this affects the stiffness in this area. With a lower thickness, the ability to withstand the pressure is also affected. The number of fatigue cycles of the liner is much less than required.

Implementation of mixed FEA formulations using object-oriented finite element programming


1. FEA Simulation objective: 
To implement mixed formulations using object-oriented finite element programming.
2. Methodology & Approach used: 
Our FEA Consultant implemented two-widely used mixed formulations namely, u/p and assumed-stress hybrid formulation considering 4-node and 8-node isoparametric elements for plane strain and plane stress cases. For assumed-stress hybrid formulation, 5-beta 4-node and 7-beta 4-node isoparametric elements are considered. A patch test is considered to investigate whether an assemblage of non-confirming elements is complete or not. A thick-cylinder under internal pressure is solved using the above elements and compared displacements of an eight-node element (2-13-12-84-85-91-16-15), stresses at four-corner nodes (2-12-85-16) with the model created in ANSYS.
3. Outcome & Conclusion:
The robustness of mixed formulations is observed by comparing error in \sigma_x with plane strain case of displacement-based formulation and ANSYS results w.r.t. plane strain case u/p mixed formulation.

Features & Benefits of FEA Consulting 

An actual physical engineering test can reveal you of an 

Our Engineering Consulting Clients

BroadTech Engineering works closely with clients across a diversity of key industries in Singapore, such as Electronics, Energy, Aerospace, Marine, Government, and Building & Construction.

BroadTech Engineering Client



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Please fill out the form below. Our friendly customer service staff will get back to you as soon as we can.

Featured Simulation Case Study

building energy design



shaft failure




high speed cabin




nozzle development




Call Us For a Free FEA Consultation

If you are still interested in learning more about our Consulting Services and to see what it can do for you, simply call to contact us today at +6581822236 for a no obligation discussion of your needs. Our knowledgeable and friendly engineering representative will be happy to assist.

Alternatively, for quote request, simply email us your detailed technical specification needs & requirements to

1. Powerful Simulation Software Tools

1. Powerful Simulation Software Tools

2. Simulation Consultants with Extensive Research & Professional Experience

2. Simulation Consultants with Extensive Research & Professional Experience

3. Simulation projects Completed in a Timely and Cost-effective Manner

3. Simulation projects Completed in a Timely and Cost-effective Manner

4. Proven Track Record

4. Proven Track Record

5. Affordable

5. Affordable

6. Full Knowledge Transfer

6. Full Knowledge Transfer



Contact Info

✉   info(at)
☎   (+65) 9743 9491
22 Sin Ming Lane, Midview City, Singapore 573969



Our Partners

Siemens PLM Partner_BroadTech

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Over the years, BroadTech Engineering has Set Itself Apart By Striving To Exceed Client Expectations In Terms of Accuracy, Timeliness and Knowledge Transfer. Our Process is Both Cost-Effective and Collaborative, Ensuring That We Solve Our Clients Problems.

  1. FEA Consulting
  2. CFD Consulting
  3. Electronic Design Consulting
  4. Semiconductor Design Consulting


At BroadTech Engineering, we are seasoned experts in Star CCM+ and ProPlus Software in our daily work.
We can help walk you through the software acquisition process, installation, and technical support.

  1. Siemens Star CCM+
  2. Femap (FEA)
  3. HEEDS Design Optimization
  4. Solid Edge (CAD)
  5. Proplus Solutions SPICE Simulator
  6. Proplus Solutions DFY Platform
  7. Proplus Solutions High-Capacity Waveform Viewer


Discuss With Us Your Project!